SMIC and Huawei Make 5 nm Breakthrough

Despite US limitations, Semiconductor Manufacturing International Corporation (SMIC) may have broken through the 5nm manufacturing barrier by creating a chip for Huawei. The Chinese IT behemoths now have a better opportunity to compete internationally and lessen their reliance on American suppliers thanks to this development. SMIC’s second-generation 7mm process technology was used in the production of Huawei’s HiSilicon Kirin 9000S CPU, which was unveiled earlier this year and improved device performance and efficiency.

For the Qingyun L540 laptop, Huawei currently offers an eight-core Arm-based HiSilicon Kirin 9000C CPU manufactured on a 5nm-class production node; this new chip likely was developed in cooperation with SMIC. Huawei and SMIC are using multi-patterning techniques with older DUV equipment to divide complicated patterns into simpler ones for improved precision, replicating the more advance EUV technology which is currently restricted due to US sanctions. 

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