China’s leading memory chip manufacturer, Yangtze Memory Technologies Co (YMTC), has quietly produced the world’s most advanced 3D NAND memory chip, according to TechInsights. This achievement is significant as 3D NAND memory is crucial in high-performance computing applications, particularly in AI and machine learning.
Despite facing sanctions and being added to the US Commerce Department’s Entity List, YMTC remains unwavering, focusing on dethroning memory chip giants like Samsung Electronics, SK Hynix, and Micron Technology. The company has also intensified collaboration with Chinese suppliers to produce top-tier chips using its “Xtacking 3.0” architecture.
After a similar breakthrough has been found by TechInsights in the HiSilicon Kirin 9000s processor included in the Huawei Mate 60 Pro, there is increasing evidence that China’s drive to get beyond trade barriers and establish its own domestic semiconductor supply chain is succeeding beyond expectations.
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